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Quick Details

  • Place of Origin: Guangdong, China (Mainland)
  • Brand Name: Aurora
  • Base Material: AL2O3/ALN
  • Board Thickness: 0.1~3.0
  • Min. Hole Size: 0.10mm
  • Min. Line Width: 15um
  • Min. Line Spacing: 15um
  • Surface Finishing: Gold Plating

Packaging & Delivery

Packaging Details Bule tape

Specifications

 

Depositing integrated component on substrate, such as film capacitor, film inductor, film resistor . 

 

Thin Film circuit

1. Features

l  Depositing integrated component on substrate, such as film capacitor, film inductor, film resistor and distributed circuit components

l  Wide range and high precision of component parameters

l   Excellent temperature and frequency characteristic, effective work at millimeter wave band

l  High integrity and small size

2,Metallization

²  TiW = 300–800Å (0.03–0.08µm)

²  Ni = 1000–5000Å (0.1µm–0.5µm)

²  Au = 5000–50000 Å (0.5µm–5.0µm)

3,Dimension

²  Minimum line width: < 0.01mm

²  Minimum space: < 0.01mm

²  Tolerance of key position: < 0.0025mm

²  Tolerance of film thickness: <±20%

²  Tolerance of circuit size: <0.005mm

4,Performance parameters

²   Tolerance of resistance: <±5%

²   Resistance material: TaN = 50 ohms/square

²   Tolerance of capacitance: <±20%

²   Ranger of work frequency:300MHz to 30GHz

²   Hole Dia. Min.:0.1mm

²   TCR = ± 50ppm/°C

²   Current density: 0.08mA/μm

5, Gold/Tin solder: Au/Tin80/20%

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Transaction Overview

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China (Mainland)
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